At Crystal Sonic, we are developing state-of-the-art technologies that will lower cost, reduce waste and solve the supply gap for next generation semiconductor substrate materials. By harnessing the power of sound, our core technology, Sonic Lift-off, cuts wafers with no material loss, enabling their re-use. We are a passionate team of scientists, engineers, and entrepreneurs committed to shaping the future of semiconductor manufacturing, accelerating the emergence of more efficient, more powerful devices across a variety of applications. We are looking for a skilled and detail-oriented Engineering Technician with experience in electronics and semiconductor technology to join our team. The ideal candidate will be responsible for performing wafer processing techniques, hands-on work with various equipment and tools to ensure the proper functioning of semiconductor fabrication, and equipment maintenance.
Primary responsibilities of the position include:
- Prepare semiconductor wafers, chips, and other materials for analysis, testing, and manufacturing.
- Assist in wafer bonding and other processes essential for sample preparation before testing.
- Handle semiconductor samples with care to avoid contamination or damage. Accurately document all procedures, observations, and results in accordance with quality and safety protocols.
- Assist engineers in the preparation of samples for electrical testing, optical analysis, and failure analysis.
- Work closely with design and process engineers to understand the specific requirements for sample preparation in each project and ensure consistency and accuracy.
- Ensure that equipment used in sample preparation is well-maintained, calibrated, and operating well.
- Perform key executional tasks in service of our deliverables and milestones as part of our funded research contracts.
Qualifications and Skills:
- Associate or Bachelor’s degree or equivalent work experience.
- At least 3 years of hands-on experience in semiconductor sample preparation, wafer processing, or related fields.
- Skilled in hands-on laboratory processes (wafer handling, coatings, etc.).
- Familiarity with semiconductor packaging processes, including wafer bonding.
- Familiarity with sample preparation tools and semiconductor equipment including wafer bonders.
- Detail-oriented with strong documentation and reporting skills.
- Ability to thrive and adapt within a dynamic start-up environment and able to handle uncertainty.
- Knack for problem-solving and troubleshooting.
- Curiosity and willingness to learn new skills.
Benefits
- Health care benefits (medical, dental and vision)
- Retirement benefit (401(k))
- Paid time off (vacation, public holidays, sick)
- Stock option plan
- Please send cover letter and resume to
Crystal Sonic
Phoenix, AZ, United States
ZIP: 85003
4 days ago
Valid through: 6/15/2025
Contractor